DaiwaSecurities Group Inc. said April 5 that it raised ¥50 billionthrough an unsecured bond offering.
The bonds were priced with a coupon rate of 0.40% per year andwill mature on April 25, 2023. The issue price and redemption price at maturityare both at par.
The subscription period is from April 6 to April 22 and thepayment date is April 25.
Proceeds from the issuance will be used to redeem otherbonds and for loans to consolidated subsidiaries.
Sumitomo Mitsui Banking Corp. is the bond administrator,while Japan Securities Depository Center Inc. is the book-entry transferinstitution. Daiwa Securities Co. Ltd. is the underwriter for the issuance.
As of April 4, US$1was equivalent ¥111.27.