Nippon Building Fund Inc. plans to issue ¥200 billion of investment corporation bonds in Japan, excluding short-term investment corporation bonds.
The company filed a shelf registration to the Kanto Local Finance Bureau's director-general for the issuance. It will issue the notes between Feb. 7 and Feb. 6, 2019.
Nippon Building intends to use the proceeds from the issuance to acquire certain assets, to repay loans, to redeem investment corporation bonds and for working capital, among other purposes.
As of Jan. 30, US$1 was equivalent to ¥113.84.