Featured Topics
Featured Products
Events
S&P Global Offerings
Featured Topics
Featured Products
Events
S&P Global Offerings
Featured Topics
Featured Products
Events
S&P Global Offerings
Featured Topics
Featured Products
Events
Financial and Market intelligence
Fundamental & Alternative Datasets
Government & Defense
Banking & Capital Markets
Economy & Finance
Energy Transition & Sustainability
Technology & Innovation
Podcasts & Newsletters
Financial and Market intelligence
Fundamental & Alternative Datasets
Government & Defense
Banking & Capital Markets
Economy & Finance
Energy Transition & Sustainability
Technology & Innovation
Podcasts & Newsletters
9 Feb, 2022
Loan issuer Global Tel*Link Corp., which does business as ViaPath Technologies, plans to use proceeds raised from a new $215 million second-lien term loan facility to fund a shareholder dividend, according to Moody's.
The rating agency on Feb. 7 upgraded the issuer's first-lien facility rating to B1 from B2 and affirmed the second-lien rating at Caa2 and the corporate rating at B3, with a stable outlook. Moody's said the first-lien upgrade "reflects the additional debt cushion provided by the new second-lien credit facility in a default scenario."
S&P Global Ratings said the company's ratings were not affected by the additional second-lien debt. Current corporate and first-lien ratings are B, and the second-lien rating is CCC+. The outlook is stable.
In 2018, Global Tel Link privately placed a second-lien term loan facility as part of a refinancing transaction. The company also issued a covenant-lite first-lien term loan due November 2025 at pricing of L+425, with 0% Libor floor. Credit Suisse is administrative agent on the first-lien term loan.
Global Tel Link, backed by American Securities, is a provider of telecommunications and technology services to the corrections industry. The company announced in January that it changed its name to ViaPath Technologies.