3 Feb, 2021

Rackspace Technology completes $2.3B term loan for refinancing; terms

Rackspace Technology Inc. has completed its $2.3 billion seven-year covenant-lite term loan B at pricing of L+275, with a 0.75% Libor floor and an issue price of 99.5 via a Citi-led arranger group, according to sources. Pricing came at the tight end of talk with a $100 million upsizing at the expense of a concurrent offering of pari passu secured notes. Proceeds from the loan, along with a $550 million issue of 3.50% secured notes due February 2028, will be used to refinance the issuer's existing $2.8 billion covenant-lite TLB due November 2023 (L+300, 1% floor). Rackspace Technology operates as a cloud technology services company. Terms:

Borrower Rackspace Technology Global, Inc.
Issue $2.3 billion term loan B
UoP Refinancing
Spread L+275
LIBOR floor 0.75%
Price 99.50
Tenor 7-year
YTM 3.63%
Four-year yield 3.69%
Call protection 101 soft call for 6 months
Corporate ratings B/B2
Facility ratings B+/B1
Recovery ratings 2
Financial covenants None
Arrangers Citi/Barc/BMO/MUFG/JPM/GS/Miz/RBC/CS/DB/HSBC/Apollo
Admin agent Citi
Px Talk L+275-300/0.75%/99.50
Sponsor Public
Notes Upsized by $100 million.