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3 Feb, 2021
Rackspace Technology Inc. has completed its $2.3 billion seven-year covenant-lite term loan B at pricing of L+275, with a 0.75% Libor floor and an issue price of 99.5 via a Citi-led arranger group, according to sources. Pricing came at the tight end of talk with a $100 million upsizing at the expense of a concurrent offering of pari passu secured notes. Proceeds from the loan, along with a $550 million issue of 3.50% secured notes due February 2028, will be used to refinance the issuer's existing $2.8 billion covenant-lite TLB due November 2023 (L+300, 1% floor). Rackspace Technology operates as a cloud technology services company. Terms:
| Borrower | Rackspace Technology Global, Inc. |
| Issue | $2.3 billion term loan B |
| UoP | Refinancing |
| Spread | L+275 |
| LIBOR floor | 0.75% |
| Price | 99.50 |
| Tenor | 7-year |
| YTM | 3.63% |
| Four-year yield | 3.69% |
| Call protection | 101 soft call for 6 months |
| Corporate ratings | B/B2 |
| Facility ratings | B+/B1 |
| Recovery ratings | 2 |
| Financial covenants | None |
| Arrangers | Citi/Barc/BMO/MUFG/JPM/GS/Miz/RBC/CS/DB/HSBC/Apollo |
| Admin agent | Citi |
| Px Talk | L+275-300/0.75%/99.50 |
| Sponsor | Public |
| Notes | Upsized by $100 million. |