trending Market Intelligence /marketintelligence/en/news-insights/trending/ZlouSHX31byarkJxY0IEgw2 content esgSubNav
In This List

SoftBank leads US$103M funding round for connectivity provider Skylo

Blog

New film release windows emerging in the wake of the pandemic

Blog

Widening US digital gap illustrates infrastructure bill rationale

Blog

Funding Social and Affordable Housing: A Credit Perspective

Blog

Global M&A By the Numbers: Q2 2021


SoftBank leads US$103M funding round for connectivity provider Skylo

SoftBank Group Corp. led a US$103 million series B funding round for Skylo Technologies Inc., a California-based provider of internet of things connectivity for machines, sensors and devices.

DCM Ventures, Innovation Endeavors LLC and Moore Strategic Ventures LLC, which previously invested US$13 million of series A funding in Skylo, also participated in the round.

Yoshi Segawa, vice president at SoftBank Group International, will join Skylo's board, subject to regulatory approvals.

Skylo, which now has US$116 million in capital, is conducting commercial trials of its satellite-based IoT connectivity platform in the U.S. and other regions. It plans to grow its initial footprint in India and other emerging markets before eventually expanding worldwide.