trending Market Intelligence /marketintelligence/en/news-insights/trending/ZlouSHX31byarkJxY0IEgw2 content
Log in to other products

Login to Market Intelligence Platform


Looking for more?

Contact Us

Request a Demo

You're one step closer to unlocking our suite of comprehensive and robust tools.

Fill out the form so we can connect you to the right person.

  • First Name*
  • Last Name*
  • Business Email *
  • Phone *
  • Company Name *
  • City *
  • We generated a verification code for you

  • Enter verification Code here*

* Required

In This List

SoftBank leads US$103M funding round for connectivity provider Skylo

Measuring The Wireline Digital Divide In The US

2019 Latin America Multichannel, Broadband And Mobile Market Overview

New Kagan Report: State of Mexican TV Broadcast Sector

Asia-Pacific Tower, Small Cell, DAS Projections Through 2029

SoftBank leads US$103M funding round for connectivity provider Skylo

SoftBank Group Corp. led a US$103 million series B funding round for Skylo Technologies Inc., a California-based provider of internet of things connectivity for machines, sensors and devices.

DCM Ventures, Innovation Endeavors LLC and Moore Strategic Ventures LLC, which previously invested US$13 million of series A funding in Skylo, also participated in the round.

Yoshi Segawa, vice president at SoftBank Group International, will join Skylo's board, subject to regulatory approvals.

Skylo, which now has US$116 million in capital, is conducting commercial trials of its satellite-based IoT connectivity platform in the U.S. and other regions. It plans to grow its initial footprint in India and other emerging markets before eventually expanding worldwide.