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Samsung plans US$6B investment in new semiconductor fabrication line

Samsung Electronics Co. Ltd. plans to invest US$6 billion in a new semiconductor fabrication line by 2020 in a bid to ramp up production.

The company said Feb. 23 that it broke ground on a new extreme ultraviolet, or EUV, line in Hwaseong, South Korea, with the new facility expected to be completed in the second half of 2019. The move is in response to market demand from a number of applications including mobile, server, network and high-performance computing, the company said.

The Nikkei Asian Review said in a Feb. 24 report that while the large investment is an "unusual step," Samsung appears to be raising its competition against Taiwan Semiconductor Manufacturing Co., the world's largest contract chip-maker.

Samsung, the world's fourth-largest chipmaker, is reportedly aiming for the second-highest rank with the new initiative, the Nikkei said, citing a company executive.